A sputtering magnetron is a magnetic device that is used to enhance the sputtering process (thin film deposition). Its magnetic field is used to produce “flux tunnels†which trap electrons and locally increase current density. This higher volumetric density of trapped electrons results in greater localized ionization rates, which, consequently, produces “order of magnitude†improvements in sputter deposition rates.
Inherently, these localized enhancements result in systemic inhomogenieties that manifest themselves as localized wear patterns in targets (material acting as the coating) and variations in thin film characteristics over the surface of the substrate (component receiving the coating). Consequently, the shape, distribution, and characteristics of the magnetic field produced by the sputtering magnetron are pivotal to the success of the sputtering process; not only in the lab, but in production settings as well.
HSMAG’s expertise in manipulating/enhancing magnetic field profiles results in magnetron designs focused on rectifying the shortcomings of OEM system. A sputtering magnetron’s field characteristics can be tuned to:
1. Improve Target Utilization
a. Longer Production Runs
b. Reduces Raw Material Consumption
2. Improve Thin Film Uniformity
a. Enhanced Product Functionality
3. Improve Deposition Rates
a. Higher Thru Put
In some instances, all three enhancements can be incorporated into a single magnetron design.
We have exhausted considerable efforts in developing our patented Quadrature technology for sputtering magnetrons. By incorporating strategically placed/oriented magnetic components into conventional designs (no physical changes in size), magnetrons can be designed to sputter targets up to twice as thick as their OEM counterparts while maintaining/enhancing their performance characteristics. Additionally, Quadrature technology allows for the sputtering of highly permeable magnetic targets, such as nickel or iron. This may negate the need for full cathode or system upgrades.
